Differentiate Electroplating And Electro Less Plating?
Electroplating: It is carried out by passing current Separate anode is employed Anodic reaction is M → Mn+ + ne- Thickness of the plating is 1-100μm Electroless plating: Used reducing agent Catalytic surface of the substrate acts as an anode Anodic reaction is R → 0 + ne- It has a thickness of 1-100μm
